Products

1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.3. High-temperature resistant, suitable for hot air gun reflow soldering.4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.5. Compact desktop design, saving repair table space.Specification: Package Weight One Package Weight 0.05kgs / 0.12lb One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch Qty per Carton 240 Carton Weight 13.00kgs / 28.66lb Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs40HQ: 457 cartons * 240 pcs = 109680 pcs

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